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Epson Inkjet Technology Used to Fabricate World's First Ultra-Thin Multilayer Circuit Board
Contributed by: G3nu1n3, at 12/30/2004 06:12:00 PM.

Seiko Epson Corporation ("Epson") today announced that it has succeeded in leveraging its proprietary inkjet technology to develop what the company believes is the world's first ultra-thin 20-layer circuit board.

Multilayer circuit boards are normally produced by using a photolithography process to pattern a copper foil bonded to a base board. However, the industry has struggled to produce thin, lightweight, high-density multilayer circuit boards cheaply because the traditional process requires (1) thick copper layers; (2) the creation of a different photomask for each layer; (3) a complex step for forming through-holes to electrically connect different layers; and (4) a large volume of photoresist, developer, etchants, stripping agents and other chemicals.

An inkjet-based manufacturing process has many advantages over a traditional photolithography process: (1) it uses a far lower volume of materials, since patterns are formed only in areas where they are needed, not over the entire substrate; (2) it is a dry process, so virtually no liquid waste is created; (3) it involves fewer steps, and thus consumes comparatively little energy; (4) it is readily adapted to high mix, low volume production, since no masks are used; and (5) it is well suited to multilayer structures, since interlayers can also be patterned directly onto the board. An inkjet-based process thus enables low-cost, high-density multilayer circuit boards to be produced via a green manufacturing process with a light environmental load.

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  • Me: What shall I download today?
    Friend: How about a nice new AMD Athlon 64 FX55?
    Me: How to use it though?
    Friend: Print the bugger off of course.


    By Blogger G3nu1n3, at 12/30/2004 06:14:00 PM  

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